Hadron™ 640R

Hadron™ 640R
High Performance, Dual Thermal and Visible OEM Camera Module

Hadron 640R Thermal Drone Camera
Hadron™ 640R pairs a performance-leading 640x512 resolution radiometric Boson® thermal camera with a 64MP visible camera in a single easy-to-integrate module. With a size, weight, and power (SWaP) optimized design, it is an ideal dual sensor payload for integration into unmanned aircraft systems (UAS), unmanned ground vehicles (UGV), robotic platforms, and AI-ready applications where battery life and run time are mission critical. The Boson longwave infrared (LWIR) thermal camera provides the ability to see through total darkness, smoke, most fog, glare as well as take the temperature of every pixel in the scene. The 64MP visible camera imagery enables AI and machine learning for intelligent sensing applications. With drivers available for market leading processors from NVIDIA, Qualcomm, and more plus industry-leading integration support, Hadron 640R reduces development cost and shortens time to market.

INDUSTRY-LEADING THERMAL AND VISIBLE CAMERA PERFORMANCE

Collect high-speed, dual VGA radiometric thermal and HD visible imagery in all light conditions.

BUILT FOR INTEGRATORS

Reduce development cost and time to market with a solution from a single, reliable supplier.

OPTIMIZE DESIGN AND OPERATION TIME WITH COMPACT, LIGHTWEIGHT, AND LOW-POWER MODULE

The performance, reliability and support expected from Teledyne FLIR and the industry’s most versatile HD+ MWIR camera portfolio.

Specifications

Overview
Thermal Imaging Detector Boson 640x512 pixels, 12mm pitch, USB 3.0, 2-lane MIPI
Temperature Accuracy ±5°C less, over 0°C to 100°C range
Radiometry
EO Camera Optics EFL 4.8 mm, 67° HFOV, F/# 1/2.3
EO Camera Sensor 9248 x 6944 pixels (64.2 MP), 0.7 µm pitch, 4-lane MIPI
EO Camera Video Full resolution @ 60 Hz
IMU ICM20602, I2C or SPI (selectable)
IR Camera Optics 60Hz baseline; 30 Hz runtime selectable
IR Camera Video Full resolution @ 60Hz
Thermal Imaging Detector Boson 640x512 pixels, 12mm pitch, USB 3.0, 2-lane MIPI
Connections & Communications
Software Drivers NVIDIA Jetson Nano
Qualcomm Snapdragon rb5
Qualcomm Snapdragon 865

*Contact us for latest software drivers

Electrical
Electrical Interface Hirose DF40C-50DP-0.4V (51)
Example of mating connector: DF40HC(2.5)-50DS-0.4V (51)
Power 5V, typical power dissipation <1800 mW, Max <2900 mW
Mechanical
Mechanical Interface Screw mount to back plate
Size (w/o lens) 35 x 49 x 45 mm (1.38” x 1.93” x 1.77”)
Weight 56 g
Environmental & Approvals
Environmental Sealing IP54 (with the rear interfaces sealed)
Operational & Storage Temperature -20°C to +60°C
Tested EMI Performance FCC part 15 Class B