Pre-Integrated RGB / Thermal Module
The FLIR® Hadron™ is SWaP+C optimized RGB/Thermal module designed for simplicity and performance. This light weight, low power, compact form factor includes a 12MP RGB camera, Boson thermal camera (with shutter), complete integration of IMU and can operate at up to 60 Hz. Hadron’s design ensuring maximum battery life and flight time, especially for small airframes.
View thermal and HD color images in flight. Ideal for inspection, locate and identify subjects in low light and dark conditions.
COMPACT FORM FACTOR
High resolution output designed for smaller class airframes. Low profile design enables flexible positioning on the airframe and SWaP to maintain longer air time.
FAST TIME TO MARKET
Reduce engineering and exploratory costs with this ready-out-of-the-box solution from a single source supplier.
|Size||24 x 45 x 36 mm|
|Electrical & Mechanical|
|Mechanical Interface||Screw mount to back plate|
|Environmental & Approvals|
|Operational & Storage Temperature||-20°C to +60°C|
|Tested EMI Performance||FCC part 15 Class B|
|Environmental Sealing||IP53 (with the rear interfaces sealed)|
|Imaging & Optical|
|IR Camera Sensor||Boson 320×256 pixels, 12mm pitch, USB video and CCI|
|IR Camera Optics||EFL 6.3mm, 34° HFOV, F/# 1.0|
|IR Camera Video||Full resolution @ 60Hz or 30Hz|
|EO Camera Sensor||Sony IMX412, 4056×3040 pixels, 1.55mm pitch, 4-lane MIPI|
|IEO Camera Video||Full resolution @ 60Hz See IMX412 datasheet for more options|
|IMU||ICM20602, I2C or SPI (selectable)|
|EO Camera Optics||Sunny SYD1201A, EFL 3.7mm, 80° HFOV, F/# 2.8|
|Power||5V supply voltage. Typical power dissipation < 1300mW, Max < 2820mW|
|Electrical Interface||Hadron connector: Hirose DF40C-50DP-0.4V(51) Example of mating connector: DF40HC(2.5)-50DS-0.4V(51)|