Wide Temperature Range & Effective Thermal Design
Neousys systems feature exclusive mechanical design and an efficient thermal pad for heat dissipation that effectively removes heat from the CPU and other components. The efficient heat transfer allows Neousys systems to operate with 100% CPU load under extreme conditions (maximum temperatures ranging from -40°C to 70°C) and therefore maximize processing power.
Neousys' effective thermal design ensures reliable wide temperature range operation while core technologies play important roles in Neousys system’s thermal capability.
Core Technology
Fanless Box PC
Neousys Fanless Box PC uses a uniquely designed heat sink. The CPU is situated right next to the heat sink with an extremely heat conductive material placed in between to channel the heat. While most Neousys Box PCs are fanless, some may use an optional smart fan to sustain optimum temperature inside the chassis when multiple add-on cards are installed.
Modularized Expansion Cassette Design
Neousys' patented modularized Expansion Cassette design is an innovative and brilliant way for accommodating an add-on card. The design makes installing and replacing procedures easy while the passive cooling solution is reliable and quiet during operation.
(R.O.C Patent No. M456527)
Patented Thermal Design
The patented ventilation thermal design for graphic cards allow system operating in wide temperatures range to go as low as -40°C and up to 70°C (* R.O.C Patent No. M534371). This further reinforces that the Neousys mechanical design can truly endure wide temperature conditions in the real world.
Regulated Air Flow for Add-on Cards (Optional Smart Fan)
Neousys Fanless Box PC regulates airflow for add-on cards by means of an optimized air inlet aperture and a purposely positioned fan (optional). Traditional 19" IPC has insufficient air flow due to turbulence caused by multiple fans (chassis/ CPU/ PSU) and cables...
Nuvo-6000 Series: ΔT* < 5℃
Traditional IPC: ΔT* > 10℃
